Processor (CPU)
CPU Name
Intel® Core™ i3 CPU 540 @ 3.07GHz
Threading
1 CPU - 2 Core - 4 Threads
Frequency
3059.37 MHz (23 * 133.02 MHz)
Multiplier
Current: 23 / Min: 9 / Max: 23
Architecture
Clarkdale / Stepping: K0 / Technology: 32 nm
CPUID / Ext.
6.5.5 / 6.25
IA Extensions
MMX, SSE (1, 2, 3, 3S, 4.1, 4.2), EM64T, VT-x
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 4096 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 16-way
L1 Data Cache
-
L1 Inst. Cache
-
L2 Cache
-
L3 Cache
-
Microcode
Rev. 0x2
TDP / Vcore
73 Watts / 0.96 Volts
Temperature
34 °C / 93 °F
Type
Retail (Stock Frequency : 3066 MHz)
Motherboard
Model
Foxconn H55MXV Series
Socket
Socket 1156 LGA
North Bridge
Intel Havendale/Clarkdale Host Bridge re
South Bridge
Intel H55 rev 06
BIOS
American Megatrends Inc. 080015 (07/22/2010)
Memory (RAM)
Total Size
2048 MB
Type
Single Channel (64 bit) DDR3-SDRAM
Frequency
665.1 MHz (DDR3-1330) - Ratio 4:20
Timings
9-9-9-24 (tCAS-tRCD-tRP-tRAS)
Slot #1 Module
Corsair 2048 MB (DDR3-1337)
Graphic Card (GPU)
GPU Type
Tarjeta gráfica VGA estándar @ 733 MHz
GPU VRAM
128 MB
Storage (HDD/SSD)
Model #1
SAMSUNG HD081GJ
Capacity #1
80 GB
Miscellaneous
Windows Version
Microsoft Windows 7 (6.1) 64-bit
CPU-Z Version
1.69.2 (32 bit)